Something to look forward to: Intel submitted several research papers to this year’s International Electron Devices Meeting (IEDM), highlighting their plans to pursue new 2D transistor materials and 3D packaging solutions. The new information backs CEO Pat Gelsinger’s previous statements regarding Intel’s upcoming microarchitecture design innovations. According to Intel’s Gary […]

The conclude of Moore’s Legislation is looming. Engineers and designers can do only so a lot to miniaturize transistors and pack as several of them as possible into chips. So they’re turning to other methods to chip style, incorporating technologies like AI into the course of action. Samsung, for instance, […]

It has now been more than a thirty day period given that the U.S. Commerce Section issued new guidelines that clamped down on the export of certain highly developed chips—which have armed forces or AI applications—to Chinese customers. China has yet to respond—but Beijing has multiple solutions in its arsenal. […]